Medical Device Pendant Redesign

Case Study

Using computational fluid dynamics (CFD), Syncroness engineers simulated increasing levels of heat dissipation and the resultant temperatures of the CPU die, main PCB, and pendant surfaces to evaluate feasibility of obtaining appropriate temperatures with redesigned electronics.

Simulations of the pendant included individual heat sources, natural convection, and thermal radiation, as well as various geometries, electronic components, materials, and surface finishes. These virtual prototypes showed that keeping internal power dissipation to less than 4.6W total would keep the maximum surface temperature below 90°F, which guided the CPU selection. In addition, the simulations demonstrated that the fan could be eliminated, making the enclosure smaller as well as watertight to IPX1.

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