Flexible Rigid-Flex Circuits

Case Study

Per IPC-6013 Qualification and Performance Specification for Flexible Printed Boards, “The flexible printed board may be single-sided, doublesided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, plated-through holes, and blind or buried vias (electrical connections between layers in a physical circuit). The flexible or rigid-flex printed board may contain build up High Density Interconnect (HDI) layers. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The rigid section of the printed board may contain a metal core or external metal heat frame, which may be active or non-active.”

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